Reliability Design and Electro-Thermal-Optical Simulation of Bridge-Style Infrared Thermal Emitters

Designs and simulations of silicon-based micro-electromechanical systems (MEMS) infrared (IR) thermal emitters for gas sensing application are presented. The IR thermal emitter is designed as a bridge-style hotplate (BSH) structure suspended on a silicon frame for realizing a good thermal isolation between hotplate and frame. For investigating the reliability of BSH structure, three kinds of fillet structures were designed in the contact corner between hotplate and frame. A 3-dimensional finite element method (3D-FEM) is used to investigate the electro-thermal, thermal-mechanical, and thermal-optical properties of BSH IR emitter using software COMSOLTM (COMSOL 4.3b, COMSOL Inc., Stockholm, Sweden). The simulation results show that the BSH with oval fillet has the lowest stress distribution and smoothest flows of stress streamlines, while the BSH with square fillet has the highest temperature and stress distribution. The thermal-optical and thermal-response simulations further indicate that the BSH with oval fillet is the optimal design for a reliable IR thermal emitter in spite of having slight inadequacies in emission intensity and modulation bandwidth in comparison with other two structures.